DocumentCode :
3378127
Title :
Reliability aspects of defect analysis
Author :
Bruls, E.M.J.G.
Author_Institution :
Philips Res. Labs., Eindhoven, Netherlands
fYear :
1993
fDate :
19-22 Apr 1993
Firstpage :
17
Lastpage :
26
Abstract :
Information about defects in the back-end of the production process of integrated circuits has been systematically gathered. This information is used to determine the various parameters of the defect and yield models. This paper shows that the number of defects which cause soft-faults and consequently may result in problems of reliability, is relatively high
Keywords :
electronic engineering computing; integrated circuit testing; production testing; reliability; statistical analysis; IC production testing; VMX monitor; defect analysis; geometric deformations; production process; reliability; soft-faults; yield models; Circuit faults; Costs; Digital systems; Geometry; Integrated circuit modeling; Integrated circuit reliability; Laboratories; Production; Semiconductor device modeling; System testing;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
European Test Conference, 1993. Proceedings of ETC 93., Third
Conference_Location :
Rotterdam
Print_ISBN :
0-8186-3360-3
Type :
conf
DOI :
10.1109/ETC.1993.246537
Filename :
246537
Link To Document :
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