Title :
Reliability aspects of defect analysis
Author_Institution :
Philips Res. Labs., Eindhoven, Netherlands
Abstract :
Information about defects in the back-end of the production process of integrated circuits has been systematically gathered. This information is used to determine the various parameters of the defect and yield models. This paper shows that the number of defects which cause soft-faults and consequently may result in problems of reliability, is relatively high
Keywords :
electronic engineering computing; integrated circuit testing; production testing; reliability; statistical analysis; IC production testing; VMX monitor; defect analysis; geometric deformations; production process; reliability; soft-faults; yield models; Circuit faults; Costs; Digital systems; Geometry; Integrated circuit modeling; Integrated circuit reliability; Laboratories; Production; Semiconductor device modeling; System testing;
Conference_Titel :
European Test Conference, 1993. Proceedings of ETC 93., Third
Conference_Location :
Rotterdam
Print_ISBN :
0-8186-3360-3
DOI :
10.1109/ETC.1993.246537
