Title :
Spice-accurate systemC macromodels of noisy on-chip communication channels
Author :
Terrassan, Nicola ; Bertozzi, Davide ; Bogliolo, Alessandro
Author_Institution :
ENDIF, Ferrara Univ., Ferrara
Abstract :
With the advent of nanoscale technologies, even RTL and system designers must consider interconnect analysis to provide predictable performance, reliability and meet power budgets. However, system-wide modeling of high-speed interconnects using conventional circuit simulators such as SPICE can become prohibitively CPU expensive. We propose to formulate analytical interconnect macromodels capturing noise effects, and to integrate them into the SystemC communication abstractions. Experimental results show that HDL simulations achieve an average accuracy of 5% from SPICE, while a few case studies illustrate the applicability of the proposed framework for fast exploration of physical channel configuration and performance estimation.
Keywords :
SPICE; hardware description languages; integrated circuit interconnections; integrated circuit modelling; HDL simulations; RTL; SPICE; SPICE-accurate SystemC macromodels; high-speed interconnects; nanoscale technologies; noise effects; noisy on-chip communication channels; performance estimation; physical channel configuration; Circuit noise; Circuit simulation; Communication channels; Integrated circuit interconnections; Integrated circuit reliability; Performance analysis; Power system interconnection; Power system reliability; SPICE; System-on-a-chip;
Conference_Titel :
Signal Propagation on Interconnects, 2007. SPI 2007. IEEE Workshop on
Conference_Location :
Genova
Print_ISBN :
978-1-4244-1223-5
Electronic_ISBN :
978-1-4244-1224-2
DOI :
10.1109/SPI.2007.4512195