• DocumentCode
    3378470
  • Title

    Interconnect length impact investigation by measurements

  • Author

    Sotman, M. ; Kostinsky, A. ; Zobin, G.

  • Author_Institution
    M.T.M. Sci. Ind. Center, Intel Israel, Haifa
  • fYear
    2007
  • fDate
    13-16 May 2007
  • Firstpage
    39
  • Lastpage
    42
  • Abstract
    The paper describes novel methodology for high frequency link/bus validation. For the first time the entire interconnect length range is covered. Frequency shmoo emulates PCB length change. The discovered resonance behavior correlates perfectly with theoretical prediction.
  • Keywords
    integrated circuit interconnections; printed circuits; PCB length change; frequency link-bus validation; impact investigation; interconnect length; measurements; resonance behavior; Bandwidth; Frequency; Guidelines; Impedance; Intersymbol interference; Length measurement; Resonance; Temperature; Testing; Voltage;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Signal Propagation on Interconnects, 2007. SPI 2007. IEEE Workshop on
  • Conference_Location
    Genova
  • Print_ISBN
    978-1-4244-1223-5
  • Electronic_ISBN
    978-1-4244-1224-2
  • Type

    conf

  • DOI
    10.1109/SPI.2007.4512203
  • Filename
    4512203
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=3378470