Title :
Interconnect length impact investigation by measurements
Author :
Sotman, M. ; Kostinsky, A. ; Zobin, G.
Author_Institution :
M.T.M. Sci. Ind. Center, Intel Israel, Haifa
Abstract :
The paper describes novel methodology for high frequency link/bus validation. For the first time the entire interconnect length range is covered. Frequency shmoo emulates PCB length change. The discovered resonance behavior correlates perfectly with theoretical prediction.
Keywords :
integrated circuit interconnections; printed circuits; PCB length change; frequency link-bus validation; impact investigation; interconnect length; measurements; resonance behavior; Bandwidth; Frequency; Guidelines; Impedance; Intersymbol interference; Length measurement; Resonance; Temperature; Testing; Voltage;
Conference_Titel :
Signal Propagation on Interconnects, 2007. SPI 2007. IEEE Workshop on
Conference_Location :
Genova
Print_ISBN :
978-1-4244-1223-5
Electronic_ISBN :
978-1-4244-1224-2
DOI :
10.1109/SPI.2007.4512203
