Title :
Absolute dynamic measurements of temperature changes in electronic components from a thermoreflectance optical test probe
Author :
Claeys, W. ; Dilhaire, S. ; Quintard, V. ; Dom, J.P.
Author_Institution :
Lab. de Microelectron., Bordeaux Univ., Talence, France
Abstract :
The authors have developed an optical laser probe for the measurement of absolute surface temperature changes in integrated circuits. The experimental method is based upon thermoreflectance, which is the change in reflectance due to surface temperature changes of the device. A laser beam is focused upon a small spot of an operating circuit. The reflected intensity is recorded upon a photodiode in synchronism with the circuit periodic excitation signal. The authors calibrated the device by developing a simple analytical model to calculate the surface temperature behaviour of a silicon resistive structure. The value derived for the relative reflectance temperature coefficient of silicon is in excellent agreement with the value from the literature. The results show that the laser probe to be a fast surface thermometer (DC to 10 MHz), with excellent lateral resolution (1 μm), with high sensitivity (10-3 °C) and large dynamics (ΔT:102 to 10-3 °C)
Keywords :
electronic equipment testing; integrated circuit testing; laser beam applications; optical sensors; surface phenomena; temperature measurement; thermoreflectance; 0 to 10 MHz; IC testing; Si; Van der Pauw structure; absolute surface temperature; calibration; circuit periodic excitation signal; dynamic measurements; integrated circuits; laser probe; mapping; microelectronic components testing; photodiode; reflected intensity; surface thermometer; thermoreflectance optical test probe; visualisation; Integrated circuit measurements; Integrated optics; Laser modes; Laser transitions; Optical sensors; Probes; Reflectivity; Silicon; Surface emitting lasers; Temperature measurement;
Conference_Titel :
European Test Conference, 1993. Proceedings of ETC 93., Third
Conference_Location :
Rotterdam
Print_ISBN :
0-8186-3360-3
DOI :
10.1109/ETC.1993.246579