Title :
Low loss diamond SAW devices by small grain size poly-crystalline diamond
Author :
Uemura, T. ; Fujii, S. ; Kitabayashi, H. ; Itakura, K. ; Hachigo, A. ; Nakahata, H. ; Shikata, S. ; Ishibashi, K. ; Imai, T.
Author_Institution :
IT Components Div., Sumitomo Electr. Industries, Ltd, Hyogo, Japan
Abstract :
We have successfully developed a poly-crystalline diamond film whose grain size is small, which is expected to have a low propagation loss in SAW devices. Using this diamond film, three kinds of narrow band SAW filters of the SiO2/ZnO/diamond/Si structure were fabricated with the center frequency from 2.5 to 5.0 GHz and the propagation losses in these filters were investigate. It was confirmed that the propagation loss with this diamond film is about two thirds of that with our previously studied diamond film.
Keywords :
II-VI semiconductors; acoustic wave propagation; band-pass filters; diamond; elemental semiconductors; grain size; piezoelectric semiconductors; piezoelectric thin films; silicon; silicon compounds; surface acoustic wave devices; surface acoustic wave filters; zinc compounds; 2.5 to 5.0 GHz; SiO2-ZnO-C-Si; SiO2/ZnO/diamond/Si structure; low loss diamond SAW devices; low propagation loss; narrow band SAW filters; small grain size poly-crystalline diamond; Crystallization; Frequency; Grain size; Propagation losses; SAW filters; Semiconductor films; Surface acoustic wave devices; Surface acoustic waves; Surface morphology; Zinc oxide;
Conference_Titel :
Ultrasonics Symposium, 2002. Proceedings. 2002 IEEE
Print_ISBN :
0-7803-7582-3
DOI :
10.1109/ULTSYM.2002.1193436
