Title :
[Copyright notice]
Abstract :
The following topics are dealt with: BEOL dielectrics ; compound optoelectronics; chip package interaction; circuit reliability; ESD and latch-up; electromigration; extreme environment ; failure analysis; product reliability; gate dielectrics; high voltage/RF circuits; medical electronics; 3D integrated circuits/TSV; photovoltaic devices; soft errors; thin film transistor; and transistors.
Keywords :
biomedical electronics; circuit reliability; dielectric materials; electromigration; electrostatic discharge; failure analysis; integrated circuit packaging; photoelectric devices; radiation hardening (electronics); reliability; thin film transistors; three-dimensional integrated circuits; 3D integrated circuit; BEOL dielectrics; ESD; TSV; chip package interaction; circuit reliability; compound optoelectronics; electromigratlon; extreme environment; failure analysis; gate dielectrics; high voltage/RF circuits; latch up; medical electronics; photovoltaic device; product reliability; soft errors; thin film transistor;
Conference_Titel :
Reliability Physics Symposium (IRPS), 2011 IEEE International
Conference_Location :
Monterey, CA
Print_ISBN :
978-1-4244-9113-1
Electronic_ISBN :
1541-7026
DOI :
10.1109/IRPS.2011.5784430
