Signal propagation over perforated reference planes

Author

Shan, Lei ; Ritter, Mark ; Haridass, Anand ; Weekly, Roger ; Becker, Dale ; Klink, Erich

Author_Institution

T J Watson Res. Center, IBM Corp., Yorktown Heights, NY

fYear

2007

fDate

13-16 May 2007

Firstpage

103

Lastpage

106

Abstract

Voids on reference planes are commonly seen in organic chip packages and printed circuit boards. In this paper, the effects of these voids on the signal integrity of a high-density data bus will be studied. A generic FCPBGA chip package is used to illustrate the signal integrity concerns and perform sensitivity analysis on the key mechanisms including void size, adjacent plane interactions, and adjacent signal line interactions. The results show that proper design can mitigate the signal integrity impact of reference plane voids.

Keywords

ball grid arrays; chip scale packaging; flip-chip devices; integrated circuit design; plastic packaging; system buses; FCPBGA chip package; flip chip plastic ball grid array package; high-density data bus; organic chip packages; perforated reference planes; printed circuit boards; sensitivity analysis; signal integrity; signal line interactions; signal propagation; void size; Frequency estimation; Insertion loss; Packaging; Power transmission lines; Printed circuits; Propagation losses; Resonant frequency; Signal design; Solid modeling; Voltage;

fLanguage

English

Publisher

ieee

Conference_Titel

Signal Propagation on Interconnects, 2007. SPI 2007. IEEE Workshop on

Conference_Location

Genova

Print_ISBN

978-1-4244-1223-5

Electronic_ISBN

978-1-4244-1224-2

Type

conf

DOI

10.1109/SPI.2007.4512222

Filename

4512222