Title :
Best Paper Award: The effect of a threshold failure time and bimodal behavior on the electromigration lifetime of copper interconnects
Author :
Filippi, R.G. ; Wang, Pi-Chung ; Brendler, A. ; McLaughlin, P.S. ; Poulin, J. ; Redder, B. ; Lloyd, J.R. ; Demarest, J.J.
Author_Institution :
IBM Systems and Technology Group, Hopewell Junction, NY, USA
Abstract :
The award winners and the titles of their award winning papers are listed.
Conference_Titel :
Reliability Physics Symposium (IRPS), 2011 IEEE International
Conference_Location :
Monterey, CA
Print_ISBN :
978-1-4244-9113-1
Electronic_ISBN :
1541-7026
DOI :
10.1109/IRPS.2011.5784438
