• DocumentCode
    3378822
  • Title

    Characterization of flexible interconnects in mobile devices

  • Author

    Kotiranta, Pia ; Kelander, Ilkka ; Rouvala, Markku ; Takaneva, Jussi

  • Author_Institution
    Nokia Res. Center, Helsinki
  • fYear
    2007
  • fDate
    13-16 May 2007
  • Firstpage
    113
  • Lastpage
    116
  • Abstract
    Mobile device application interface specifications have reached the data speed of gigabit per second per differential lane. Together with increased component density, miniaturization, multi-part devices, and increased signaling frequencies overlapping RF bands, the prediction of interface and system level behavior in terms of signal integrity becomes more and more complicated. This paper concentrates on signal quality studies of a gigabit-speed digital serial interface. The test system is implemented considering a mobile device with moving parts, and corresponding simulation models are built using various simulation tools. The study discusses the correlation between measured and simulated results, adducing also the modeling feasibility of the test system.
  • Keywords
    flexible electronics; integrated circuit interconnections; mobile communication; digital serial interface; flexible interconnects; interface specifications; miniaturization; mobile device; multipart devices; signal integrity; signal quality; Bandwidth; Displays; Flexible printed circuits; Power system modeling; Protocols; RF signals; Standards development; System testing; Test equipment; Transmission line measurements;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Signal Propagation on Interconnects, 2007. SPI 2007. IEEE Workshop on
  • Conference_Location
    Genova
  • Print_ISBN
    978-1-4244-1223-5
  • Electronic_ISBN
    978-1-4244-1224-2
  • Type

    conf

  • DOI
    10.1109/SPI.2007.4512225
  • Filename
    4512225