• DocumentCode
    3379016
  • Title

    Silicon/epoxy nanocomposites for capacitors as the energy storage element

  • Author

    Weixing Sun ; Xiaoli Tan ; Kessler, Michael R. ; Bowler, Nicola

  • Author_Institution
    Dept. of Mater. Sci. & Eng., Iowa State Univ., Ames, IA, USA
  • fYear
    2013
  • fDate
    20-23 Oct. 2013
  • Firstpage
    676
  • Lastpage
    679
  • Abstract
    Silicon/epoxy nanocomposites were synthesized in order to investigate potential improvement of electrical energy storage capability and mechanical properties of epoxy resin on addition of Si nanospheres. Nanospheres with mean diameter 130 nm were homogenized within epoxy monomers at 5 and 10 wt.%. The dielectric behavior of the resulting nanocomposites was investigated using broadband dielectric spectroscopy from 10-2 to 106 Hz at room temperature. The dielectric constant, ε´r, of the composite with 10 wt.% Si loading is ~ 5.1 at 10-2 Hz, a 25% increase compared with the value for neat epoxy, whereas tan ô remains low (<; 0.035). On the other hand, a 17% increase of storage modulus was shown in the composite with 5 wt.% Si loading, compared with that of neat epoxy, and Tg of the polymer matrix was slightly elevated with Si incorporation. The increases in both permittivity and storage modulus suggest that Si/epoxy nanocomposites are suitable for multifunctional application; e.g. as structural capacitors.
  • Keywords
    capacitor storage; mechanical properties; nanocomposites; permittivity; resins; silicon; Si; broadband dielectric spectroscopy; capacitor storage; dielectric constant; electrical energy storage; energy storage element; epoxy monomers; epoxy resin; mechanical properties; polymer matrix; silicon-epoxy nanocomposites; size 130 nm; storage modulus; Dielectrics; Epoxy resins; Loading; Nanocomposites; Nanoparticles; Polymers; Silicon; Si nanoparticles; dielectric properties; epoxy-based nanoparticles; mechanical properties;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical Insulation and Dielectric Phenomena (CEIDP), 2013 IEEE Conference on
  • Conference_Location
    Shenzhen
  • Type

    conf

  • DOI
    10.1109/CEIDP.2013.6747423
  • Filename
    6747423