Title :
Suppression effects of electromagnetic radiation from inner-lead portion molded by ferrite-resin composite
Author :
Akino, Tadaharu ; Ono, Yasuhiro ; Shinohara, Shinichi ; Sato, Risaburo
Author_Institution :
Electromagn. Compatibility Res. Labs. Co. Ltd., Sendai, Japan
Abstract :
This paper describes the suppression effects of electromagnetic waves radiating from the inner-lead portion of lead terminals molded by ferrite-resin composite in semiconductor devices. First, using composites in molded cylindrical form having various ferrite powder content, the complex relative permeability and complex relative permittivity were measured using the Nicolson-Ross, Weir method. Next, the impedance of the inner-lead portion of the lead terminal specimens, molded by the same ferrite-resin composite, was measured. Following this, each of the lead terminal specimens was mounted on a printed wiring board settled in a shield box, and electromagnetic radiation from the inner-lead was measured in an anechoic chamber, while terminating one end of the lead terminal to a 50 ohms resistor and feeding a high frequency signal through the other end. The results of these experiments showed that electromagnetic radiation from the inner-lead portion can be effectively suppressed by molding the lead terminal by ferrite-resin composite having a ferrite powder content of 80 weight-% or greater
Keywords :
composite materials; electric impedance; ferrites; interference suppression; magnetic permeability; permittivity; radiofrequency interference; semiconductor devices; 300 MHz to 1.8 GHz; Nicolson-Ross Weir method; UHF; complex relative permeability; complex relative permittivity; electromagnetic radiation; electromagnetic waves; ferrite powder content; ferrite-resin composite; impedance; inner-lead portion; printed wiring board; semiconductor devices; shield box; suppression effects; Electromagnetic measurements; Electromagnetic radiation; Electromagnetic scattering; Ferrites; Impedance; Lead compounds; Permeability measurement; Permittivity measurement; Powders; Semiconductor devices;
Conference_Titel :
Electromagnetic Compatibility, 1999 IEEE International Symposium on
Conference_Location :
Seattle, WA
Print_ISBN :
0-7803-5057-X
DOI :
10.1109/ISEMC.1999.810204