DocumentCode :
3379289
Title :
Active substrates for optoelectronic interconnect
Author :
Chiarulli, Donald ; Levitan, Steven ; Bakos, Jason
Author_Institution :
Dept. of Comput. Sci. & Electr. Eng., Pittsburgh Univ., PA, USA
Volume :
5
fYear :
2004
fDate :
23-26 May 2004
Abstract :
We present the design of an intelligent optoelectronic chip carrier (IOCC). This is an active package that is the basis for short haul, PCB by Chiarulli and Levitan (2003) and MCM by Bakos et al. (2003) and Selavo et al. (2003) level, optical interconnect. Our goal is a new solution to one of the most difficult problems associated with the packaging of chip-level optical interconnections; the dense and spatially interleaved integration of optical signaling with electric signals, power and ground. Our approach is based on an "active substrate" using Peregrine UTSi silicon on sapphire technology and the adaptation of laser drilling techniques to create vias through the sapphire. The result is an optoelectronic package that supports full CMOS performance, is mechanically and electrically compatible with current ball grid array (BGA) technology for electronic interconnect, and provides windows for active side optical I/O and substrate-side thermal extraction paths.
Keywords :
integrated circuit packaging; integrated optoelectronics; laser beam machining; optical interconnections; sapphire; silicon; silicon-on-insulator; Al2O3; CMOS performance support; MCM level; PCB level; Peregrine UTSi; Si; active package; active side optical I/O; active substrates; ball grid array; chip-level packaging; electric signals; electrically compatibility; electronic interconnect; intelligent optoelectronic chip carrier; laser drilling; mechanically compatibility; optical interconnect; optical signaling; optoelectronic interconnect; optoelectronic package; power-ground integration; short haul level; silicon on sapphire; spatially interleaved integration; substrate-side thermal extraction path; vias creation; CMOS technology; Driver circuits; Integrated circuit interconnections; Optical arrays; Optical crosstalk; Optical interconnections; Optical receivers; Packaging; Pins; Silicon;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Circuits and Systems, 2004. ISCAS '04. Proceedings of the 2004 International Symposium on
Print_ISBN :
0-7803-8251-X
Type :
conf
DOI :
10.1109/ISCAS.2004.1329877
Filename :
1329877
Link To Document :
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