Poster session B chip, packaging & material issues

fYear

2007

fDate

13-16 May 2007

Firstpage

207

Lastpage

208

Abstract

Start of the above-titled section of the conference proceedings record.

fLanguage

English

Publisher

ieee

Conference_Titel

Signal Propagation on Interconnects, 2007. SPI 2007. IEEE Workshop on

Conference_Location

Genova

Print_ISBN

978-1-4244-1223-5

Type

conf

DOI

10.1109/SPI.2007.4512252

Filename

4512252

Link To Document