Title :
Poster session B chip, packaging & material issues
Abstract :
Start of the above-titled section of the conference proceedings record.
Conference_Titel :
Signal Propagation on Interconnects, 2007. SPI 2007. IEEE Workshop on
Conference_Location :
Genova
Print_ISBN :
978-1-4244-1223-5
DOI :
10.1109/SPI.2007.4512252
