DocumentCode :
3379348
Title :
Translayer optimized co-design of in-space microwave based wireless power transfer
Author :
Bou, Elisenda ; Alarcón, Eduard ; Saenz-Otero, Alvar ; Mandy, Christopher
Author_Institution :
Electron. Eng. Dept., UPC BarcelonaTech, Barcelona, Spain
fYear :
2010
fDate :
May 30 2010-June 2 2010
Firstpage :
885
Lastpage :
888
Abstract :
In space applications, system designs involve a particularly thorough assessment of performance, reliability and stability, as failure cost increases very significantly at each design stage. This effort has to be stressed when evaluating the feasibility of an innovative concept such as an In-Space Wireless Power Transmission (WPT) link. In this context, this work addresses modelling/characterizing the relationships between the input design variables at subsystem level upon complete system-level performance metrics, thereby stablishing a translayer bridge between different system levels of a WPT link based on microwave RF power. The proposed design-oriented modelling framework allows to derive optimum design, which is of particular interest if a comparison of different alternative WPT methods is to be eventually addressed. The microwave WPT link is finally designed by solving the convex optimization problem of maximizing a set of target performance metrics compressed in a single merit figure, considering as the input design space the open design variables associated to the subsystem descriptions. The presented approach yields a design showing the feasibility of the WPT link with a required power of 100W from 0 to 100 meters with an efficiency range from 15% to 45%.
Keywords :
microwave power transmission; optimisation; WPT link; in-space microwave RF power; in-space wireless power transmission; optimization problem; Bridges; Context modeling; Costs; Design optimization; Measurement; Power system modeling; Power system reliability; Power transmission; Radio frequency; Stability;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Circuits and Systems (ISCAS), Proceedings of 2010 IEEE International Symposium on
Conference_Location :
Paris
Print_ISBN :
978-1-4244-5308-5
Electronic_ISBN :
978-1-4244-5309-2
Type :
conf
DOI :
10.1109/ISCAS.2010.5537417
Filename :
5537417
Link To Document :
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