• DocumentCode
    3379429
  • Title

    Dielectric modeling, characterization, and validation up to 40 GHz

  • Author

    Pytel, Steven G. ; Barnes, Guy ; Hua, Daniel ; Moonshiram, Anusha ; Brist, Gary ; Mellitz, Richard I. ; Hall, Stephen H. ; Huray, Paul G.

  • Author_Institution
    Intel Corp., Columbia, SC
  • fYear
    2007
  • fDate
    13-16 May 2007
  • Firstpage
    229
  • Lastpage
    232
  • Abstract
    As computer speeds continue to scale with Moore´s law, improved transmission line modeling techniques are required for data rates greater than 3-5 gigabits per second (Gb/s). These transmission line models must accurately predict the interconnect characteristics to provide silicon designers correct channel parameters to ensure viable products. This work describes an analytic dielectric modeling methodology that produces accurate dielectric characteristics up to 40 GHz. Validation of multiple dielectric materials was performed up to 40 GHz by direct and indirect measurement techniques. The dielectric materials chosen for this study were based upon commonly available dielectrics that are suitable for high volume manufacturing in the printed wiring board industry.
  • Keywords
    dielectric materials; interconnections; printed circuit manufacture; transmission lines; Moore´s law; dielectric modeling; high-volume manufacturing; interconnect characteristics; multiple dielectric materials; printed wiring board industry; transmission line modeling techniques; Computer industry; Dielectric materials; Dielectric measurements; Equations; Frequency estimation; Frequency measurement; Moore´s Law; Permittivity measurement; Silicon; Transmission lines; Computers; Dielectric materials; Interconnects; Modeling; Transmission lines;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Signal Propagation on Interconnects, 2007. SPI 2007. IEEE Workshop on
  • Conference_Location
    Genova
  • Print_ISBN
    978-1-4244-1223-5
  • Electronic_ISBN
    978-1-4244-1224-2
  • Type

    conf

  • DOI
    10.1109/SPI.2007.4512258
  • Filename
    4512258