DocumentCode
3379429
Title
Dielectric modeling, characterization, and validation up to 40 GHz
Author
Pytel, Steven G. ; Barnes, Guy ; Hua, Daniel ; Moonshiram, Anusha ; Brist, Gary ; Mellitz, Richard I. ; Hall, Stephen H. ; Huray, Paul G.
Author_Institution
Intel Corp., Columbia, SC
fYear
2007
fDate
13-16 May 2007
Firstpage
229
Lastpage
232
Abstract
As computer speeds continue to scale with Moore´s law, improved transmission line modeling techniques are required for data rates greater than 3-5 gigabits per second (Gb/s). These transmission line models must accurately predict the interconnect characteristics to provide silicon designers correct channel parameters to ensure viable products. This work describes an analytic dielectric modeling methodology that produces accurate dielectric characteristics up to 40 GHz. Validation of multiple dielectric materials was performed up to 40 GHz by direct and indirect measurement techniques. The dielectric materials chosen for this study were based upon commonly available dielectrics that are suitable for high volume manufacturing in the printed wiring board industry.
Keywords
dielectric materials; interconnections; printed circuit manufacture; transmission lines; Moore´s law; dielectric modeling; high-volume manufacturing; interconnect characteristics; multiple dielectric materials; printed wiring board industry; transmission line modeling techniques; Computer industry; Dielectric materials; Dielectric measurements; Equations; Frequency estimation; Frequency measurement; Moore´s Law; Permittivity measurement; Silicon; Transmission lines; Computers; Dielectric materials; Interconnects; Modeling; Transmission lines;
fLanguage
English
Publisher
ieee
Conference_Titel
Signal Propagation on Interconnects, 2007. SPI 2007. IEEE Workshop on
Conference_Location
Genova
Print_ISBN
978-1-4244-1223-5
Electronic_ISBN
978-1-4244-1224-2
Type
conf
DOI
10.1109/SPI.2007.4512258
Filename
4512258
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