DocumentCode :
3379450
Title :
Crosstalk reduction technique on data-bus in DSM technology
Author :
Sathish, A. ; Latha, M. Madhavi ; Kishore, K. Lal ; Reddy, Kommi Krishna
Author_Institution :
Dept. of ECE, RGMCET, Nandyal, India
fYear :
2011
fDate :
21-22 July 2011
Firstpage :
486
Lastpage :
489
Abstract :
In Deep-submicron (DSM) and Very Deep-submicron (VDSM) technologies, Scaling the minimum feature size of VLSI circuits has caused the crosstalk noise to become a serious problem, degrading the performance and reliability of high speed integrated circuits. In many digital processors and SoC interconnects and buses are dominating the silicon area than the logic. These interconnects are prone to errors due to crosstalk. The major part of the crosstalk is due to coupling transitions occurring on the data bus and interconnects when signals are transmitted. Reducing the crosstalk is an important design factor. This crosstalk introduces errors on the data bus there by affecting the reliability of the system. This crosstalk can be reduced by reducing the coupling transitions. Hence reducing transitions can reduce crosstalk. One of the best techniques to reduce the crosstalk is to encode the data on the data bus. Hence Crosstalk efficient data bus encoding scheme is proposed which can reduce the 4C, 3C and 2C by 91% to 94%, 68% to 72%, 17% to 24% respectively.
Keywords :
VLSI; crosstalk; field buses; high-speed integrated circuits; integrated circuit interconnections; integrated circuit noise; integrated circuit reliability; system-on-chip; SoC interconnects; VDSM technology; VLSI circuit; crosstalk noise; crosstalk reduction; data-bus; digital processor; high speed integrated circuit; reliability; very deep-submicron technology; Capacitance; Couplings; Crosstalk; Delay; Encoding; System-on-a-chip; Wires; Coupling transitions; DSM; SoC; VDSM; VLSI; crosstalk; interconnects;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Signal Processing, Communication, Computing and Networking Technologies (ICSCCN), 2011 International Conference on
Conference_Location :
Thuckafay
Print_ISBN :
978-1-61284-654-5
Type :
conf
DOI :
10.1109/ICSCCN.2011.6024599
Filename :
6024599
Link To Document :
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