Title :
Integrating III-V on Silicon for Future Nanoelectronics
Author :
Hudait, Mantu K. ; Chau, Robert
Author_Institution :
Technol. & Manuf. Group, Intel Corp., Hillsboro, OR
Abstract :
This paper describes about III-V integration on silicon and summarizes the recent progress on the research efforts to combine the merits of III-V and silicon, on the same silicon wafer, for future high-speed and low-power nanoelectronics. The successful integration of III-V on silicon can open up opportunities for integrating new functionalities and features on silicon, such as integrating logic, optoelectronic and communication platforms on the same Si wafer.
Keywords :
III-V semiconductors; high-speed integrated circuits; integrated optoelectronics; low-power electronics; nanoelectronics; III-V integration; Si; high-speed nanoelectronics; integrated optoelectronics; low-power nanoelectronics; silicon wafer; CMOS technology; Energy efficiency; FETs; III-V semiconductor materials; MOSFETs; Manufacturing; Nanoelectronics; Postal services; Silicon; Substrates;
Conference_Titel :
Compound Semiconductor Integrated Circuits Symposium, 2008. CSIC '08. IEEE
Conference_Location :
Monterey, CA
Print_ISBN :
978-1-4244-1939-5
Electronic_ISBN :
1550-8781
DOI :
10.1109/CSICS.2008.8