DocumentCode
3379697
Title
A swallowable diagnostic capsule with a direct access sensor using Anisotropic Conductive Adhesive
Author
Jesudoss, Pio ; Mathewson, Alan ; Twomey, Karen ; Stam, Frank ; Wright, William M D
Author_Institution
Microelectron. Applic. Integration, Tyndall Nat. Inst., Cork, Ireland
fYear
2011
fDate
10-14 April 2011
Abstract
Technological developments in biomedical microsystems are opening up new opportunities to improve healthcare procedures. Swallowable diagnostic sensing capsules are an example of this. In this paper, a novel direct access sensor (DAS) has been demonstrated which uses Flip Chip (FC) technology to expose the sensor to the liquid medium. An electrochemical study showed that the Anisotropic Conductive Adhesive (ACA) joint provides good connection and does not impair the sensor functionality. The reliability test results showed that most of the samples survived the humidity aging test and that only 2 out of 9 ACA connections of the same electrode failed. For the failed samples, the failure analysis showed that the tensile stress at the chip/epoxy interface caused a delamination at this interface.
Keywords
biomechanics; biosensors; conductive adhesives; delamination; electrochemical electrodes; electrochemical sensors; patient diagnosis; reliability; anisotropic conductive adhesive; biomedical microsystems; chip-epoxy interface; delamination; direct access sensor; failure analysis; flip chip technology; health care; humidity aging testing; reliability testing; swallowable diagnostic sensing capsules; tensile stress; Aging; Contact resistance; Electrical resistance measurement; Electrodes; Gold; Humidity; Substrates; Anisotropic conuctive ahesive (ACA); Direct Access Sensor (DAS); Flip hip Over Hole (FCOH); reliability; swallowable diagnostic sensing capsule;
fLanguage
English
Publisher
ieee
Conference_Titel
Reliability Physics Symposium (IRPS), 2011 IEEE International
Conference_Location
Monterey, CA
ISSN
1541-7026
Print_ISBN
978-1-4244-9113-1
Electronic_ISBN
1541-7026
Type
conf
DOI
10.1109/IRPS.2011.5784481
Filename
5784481
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