Title :
A swallowable diagnostic capsule with a direct access sensor using Anisotropic Conductive Adhesive
Author :
Jesudoss, Pio ; Mathewson, Alan ; Twomey, Karen ; Stam, Frank ; Wright, William M D
Author_Institution :
Microelectron. Applic. Integration, Tyndall Nat. Inst., Cork, Ireland
Abstract :
Technological developments in biomedical microsystems are opening up new opportunities to improve healthcare procedures. Swallowable diagnostic sensing capsules are an example of this. In this paper, a novel direct access sensor (DAS) has been demonstrated which uses Flip Chip (FC) technology to expose the sensor to the liquid medium. An electrochemical study showed that the Anisotropic Conductive Adhesive (ACA) joint provides good connection and does not impair the sensor functionality. The reliability test results showed that most of the samples survived the humidity aging test and that only 2 out of 9 ACA connections of the same electrode failed. For the failed samples, the failure analysis showed that the tensile stress at the chip/epoxy interface caused a delamination at this interface.
Keywords :
biomechanics; biosensors; conductive adhesives; delamination; electrochemical electrodes; electrochemical sensors; patient diagnosis; reliability; anisotropic conductive adhesive; biomedical microsystems; chip-epoxy interface; delamination; direct access sensor; failure analysis; flip chip technology; health care; humidity aging testing; reliability testing; swallowable diagnostic sensing capsules; tensile stress; Aging; Contact resistance; Electrical resistance measurement; Electrodes; Gold; Humidity; Substrates; Anisotropic conuctive ahesive (ACA); Direct Access Sensor (DAS); Flip hip Over Hole (FCOH); reliability; swallowable diagnostic sensing capsule;
Conference_Titel :
Reliability Physics Symposium (IRPS), 2011 IEEE International
Conference_Location :
Monterey, CA
Print_ISBN :
978-1-4244-9113-1
Electronic_ISBN :
1541-7026
DOI :
10.1109/IRPS.2011.5784481