• DocumentCode
    3379697
  • Title

    A swallowable diagnostic capsule with a direct access sensor using Anisotropic Conductive Adhesive

  • Author

    Jesudoss, Pio ; Mathewson, Alan ; Twomey, Karen ; Stam, Frank ; Wright, William M D

  • Author_Institution
    Microelectron. Applic. Integration, Tyndall Nat. Inst., Cork, Ireland
  • fYear
    2011
  • fDate
    10-14 April 2011
  • Abstract
    Technological developments in biomedical microsystems are opening up new opportunities to improve healthcare procedures. Swallowable diagnostic sensing capsules are an example of this. In this paper, a novel direct access sensor (DAS) has been demonstrated which uses Flip Chip (FC) technology to expose the sensor to the liquid medium. An electrochemical study showed that the Anisotropic Conductive Adhesive (ACA) joint provides good connection and does not impair the sensor functionality. The reliability test results showed that most of the samples survived the humidity aging test and that only 2 out of 9 ACA connections of the same electrode failed. For the failed samples, the failure analysis showed that the tensile stress at the chip/epoxy interface caused a delamination at this interface.
  • Keywords
    biomechanics; biosensors; conductive adhesives; delamination; electrochemical electrodes; electrochemical sensors; patient diagnosis; reliability; anisotropic conductive adhesive; biomedical microsystems; chip-epoxy interface; delamination; direct access sensor; failure analysis; flip chip technology; health care; humidity aging testing; reliability testing; swallowable diagnostic sensing capsules; tensile stress; Aging; Contact resistance; Electrical resistance measurement; Electrodes; Gold; Humidity; Substrates; Anisotropic conuctive ahesive (ACA); Direct Access Sensor (DAS); Flip hip Over Hole (FCOH); reliability; swallowable diagnostic sensing capsule;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Reliability Physics Symposium (IRPS), 2011 IEEE International
  • Conference_Location
    Monterey, CA
  • ISSN
    1541-7026
  • Print_ISBN
    978-1-4244-9113-1
  • Electronic_ISBN
    1541-7026
  • Type

    conf

  • DOI
    10.1109/IRPS.2011.5784481
  • Filename
    5784481