DocumentCode :
3379880
Title :
Study of Electrothermal Stress Effect on RF Performance of InGaP/GaAs Heterojunction Bipolar Transistor-Based Low-Noise Amplifier
Author :
Liu, Xiang ; Yuan, Jiann-shiun ; Liou, Juin J.
Author_Institution :
Sch. of Electr. Eng. & Comput. Sci., Univ. of Central Florida, Orlando, FL
fYear :
2008
fDate :
12-15 Oct. 2008
Firstpage :
1
Lastpage :
4
Abstract :
This paper investigates the electrothermal stress- induced performance degradation of a cascode low-noise amplifier (LNA) built using InGaP/GaAs heterojunction bipolar transistors (HBTs). Changes in device characteristics due to the electrothermal stress were examined experimentally. At the moderate base-emitter voltage, the base current increases and current gain decreases after stress. The SPICE Gummel-Poon (SGP) model parameters were extracted before and after stress and measured device data were used in the Cadence SpectreRF simulation to study the impact of electrothermal stress on the low-noise amplifier performance.
Keywords :
III-V semiconductors; SPICE; gallium arsenide; gallium compounds; heterojunction bipolar transistors; indium compounds; low noise amplifiers; RF performance; SPICE Gummel-Poon model parameters; electrothermal stress effect; heterojunction bipolar transistor-based low-noise amplifier; Bipolar transistors; Degradation; Electrothermal effects; Gallium arsenide; Heterojunction bipolar transistors; Low-noise amplifiers; Radio frequency; SPICE; Stress; Voltage;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Compound Semiconductor Integrated Circuits Symposium, 2008. CSIC '08. IEEE
Conference_Location :
Monterey, CA
ISSN :
1550-8781
Print_ISBN :
978-1-4244-1939-5
Electronic_ISBN :
1550-8781
Type :
conf
DOI :
10.1109/CSICS.2008.15
Filename :
4674470
Link To Document :
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