Title :
Approaches to high pin count and high power surface mount packages
Author :
Lin, Peng ; McShane, M.
Author_Institution :
Motorola Inc., Austin, TX, USA
Abstract :
Recent VLSI devices for consumer product require packages with high pin count (more than 200 I/Os) and/or high power dissipation (over two watts) capability. The authors review various approaches to address these requirements with emphasis on surface mount packages. Furthermore, for portable consumer products such as digital cellular telephones, notebook computers or video cameras, thin and light packages are preferred. Plastic pad array carrier (PAC) are also described in order to achieve high frequency SMTs
Keywords :
VLSI; surface mount technology; VLSI devices; high pin count; high power; light packages; plastic pad array carrier; portable consumer products; surface mount packages; Consumer products; Digital cameras; Frequency; Operating systems; Packaging; Plastics; Portable computers; Power dissipation; Telephony; Very large scale integration;
Conference_Titel :
VLSI Technology, Systems, and Applications, 1991. Proceedings of Technical Papers, 1991 International Symposium on
Conference_Location :
Taipei
Print_ISBN :
0-7803-0036-X
DOI :
10.1109/VTSA.1991.246694
