DocumentCode
3380061
Title
Approaches to high pin count and high power surface mount packages
Author
Lin, Peng ; McShane, M.
Author_Institution
Motorola Inc., Austin, TX, USA
fYear
1991
fDate
22-24 May 1991
Firstpage
141
Lastpage
146
Abstract
Recent VLSI devices for consumer product require packages with high pin count (more than 200 I/Os) and/or high power dissipation (over two watts) capability. The authors review various approaches to address these requirements with emphasis on surface mount packages. Furthermore, for portable consumer products such as digital cellular telephones, notebook computers or video cameras, thin and light packages are preferred. Plastic pad array carrier (PAC) are also described in order to achieve high frequency SMTs
Keywords
VLSI; surface mount technology; VLSI devices; high pin count; high power; light packages; plastic pad array carrier; portable consumer products; surface mount packages; Consumer products; Digital cameras; Frequency; Operating systems; Packaging; Plastics; Portable computers; Power dissipation; Telephony; Very large scale integration;
fLanguage
English
Publisher
ieee
Conference_Titel
VLSI Technology, Systems, and Applications, 1991. Proceedings of Technical Papers, 1991 International Symposium on
Conference_Location
Taipei
ISSN
1524-766X
Print_ISBN
0-7803-0036-X
Type
conf
DOI
10.1109/VTSA.1991.246694
Filename
246694
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