Fabrication of Feedthrough Atom Trapping Chips for Atomic Optics

Author

Chuang, H. C Rick ; Hakala, T.K. ; Anderson, D.Z. ; Bright, V.M.

Author_Institution

Univ. of Colorado, Boulder

fYear

2007

fDate

10-14 June 2007

Firstpage

2059

Lastpage

2062

Abstract

We present a novel fabrication process for feedthrough atom trapping chips, which are used in atomic condensate optics. Copper electroplating is employed to vacuum seal the chip-through vias. The advantages of using feedthrough atom trapping chips are the simple microfabrication process and reduction of the overall chip area bonded to the glass atom trapping cell. The results demonstrate that current can be conducted through the vias while the vacuum can also be held under 1times10^-9 torr.

Keywords

Bose-Einstein condensation; atom optics; copper; electroplating; micro-optomechanical devices; quantum optics; radiation pressure; Bose-Einstein condensation; Cu; atomic condensate optics; chip-through vias process; copper electroplating; feedthrough atom trapping chips fabrication; microfabrication process; overall chip area reduction; vacuum seal; Atom optics; Bonding; Charge carrier processes; Connectors; Copper; Glass; Optical device fabrication; Seals; Silicon; Wires; Atom Chips; BEC; Copper Electroplating; Feedthrough;

fLanguage

English

Publisher

ieee

Conference_Titel

Solid-State Sensors, Actuators and Microsystems Conference, 2007. TRANSDUCERS 2007. International

Conference_Location

Lyon

Print_ISBN

1-4244-0842-3

Electronic_ISBN

1-4244-0842-3

Type

conf

DOI

10.1109/SENSOR.2007.4300569

Filename

4300569