Title :
Via-Free Interconnection in Quasi-Hermetic Wafer-Level Packaging for RF-MEMS Applications and 3D Integration
Author :
Phommahaxay, Alain ; Lissorgues, Gaëlle ; Rousseau, Lionel ; Perrais, Vincent ; Marty, Frédéric ; Bourouina, Tarik ; Nicole, Pierre
Author_Institution :
ESIEE Paris - ESYCOM, Paris
Abstract :
The development of an interconnection method based on electromagnetic coupling for hermetic or vacuum packaging in RF-MEMS applications is presented in this paper. Combined with wafer-level packaging by anodic bonding, it minimizes the leakage probability of such package by avoiding the use of vertical interconnections or horizontal feedthroughs. Electromagnetic simulations will be discussed and compared to microwave measurements on coupling structures.
Keywords :
electromagnetic coupling; micromechanical devices; superconducting interconnections; wafer level packaging; 3D integration; RF-MEMS application; anodic bonding; electromagnetic coupling; electromagnetic simulation; interconnection method; leakage probability; microwave measurement; quasihermetic wafer-level packaging; vacuum packaging; Aluminum; Capacitors; Electromagnetic coupling; Fabrication; Inductors; Packaging; Radiofrequency microelectromechanical systems; Silicon; Wafer bonding; Wafer scale integration; Electromagnetic Coupling; Interconnection; Microwave Transition; Wafer-Level Packaging;
Conference_Titel :
Solid-State Sensors, Actuators and Microsystems Conference, 2007. TRANSDUCERS 2007. International
Conference_Location :
Lyon
Print_ISBN :
1-4244-0842-3
Electronic_ISBN :
1-4244-0842-3
DOI :
10.1109/SENSOR.2007.4300570
