DocumentCode :
3380444
Title :
Realtime 3D Stress Measurement in Curing Epoxy Packaging
Author :
Richter, J. ; Hyldgård, A. ; Birkelund, K. ; Hansen, O. ; Thomsen, E.V.
Author_Institution :
Tech. Univ. of Denmark, Kgs Lyngby
fYear :
2007
fDate :
10-14 June 2007
Firstpage :
2083
Lastpage :
2086
Abstract :
This paper presents a novel method to characterize stress in microsystem packaging. A circular p-type piezoresistor is implemented on a (001) silicon chip. We use the circular stress sensor to determine the packaging induced stress in a polystyrene tube filled with epoxy. The epoxy curing process is monitored by stress measurements. From the stress measurements we conclude that the epoxy cures in 8 hours at room temperature. We find the difference in in-plane normal stresses to be sigmaxx-sigmayy=6.7 MPa and (sigmaxx+sigmayy-0.4sigmazz)=232 MPa.
Keywords :
curing; electronics packaging; micromechanical devices; piezoresistive devices; polymers; process monitoring; resistors; sensors; silicon; stress measurement; 3D stress measurement; circular p-type piezoresistor; circular stress sensor; epoxy curing process; microsystem packaging; polystyrene tube; process monitoring; Curing; Electronics packaging; Integrated circuit measurements; Integrated circuit packaging; Piezoresistance; Protection; Resistors; Semiconductor device measurement; Silicon; Stress measurement; epoxy; packaging; stress sensor;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Solid-State Sensors, Actuators and Microsystems Conference, 2007. TRANSDUCERS 2007. International
Conference_Location :
Lyon
Print_ISBN :
1-4244-0842-3
Electronic_ISBN :
1-4244-0842-3
Type :
conf
DOI :
10.1109/SENSOR.2007.4300575
Filename :
4300575
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=3380444
بازگشت