Abstract :
The following topics are dealt with: computer aided design; system estimation; system evaluation; design optimization; manufacturing-aware design; analog signal verification; mixed signal verification; process variation; digital system; embedded system; FPGA synthesis; power-sensitive condition; reliability analysis; memory system scheduling; physical synthesis; yield analysis; quality analysis; nanometer CMOS; analog functionality; synchronous system; asynchronous system; global routing; system level design; low power design; beyond-die design; clock distribution; 3D IC; fault detection; hardware Trojan; organic electronics; timing analysis; power grid; interconnect analysis; digital microfluidic biochip; logic synthesis; power optimization; thermal-aware architecture; 3D MPSoC; many-core system; circuit reliability; and device reliability.
Keywords :
CMOS integrated circuits; analogue integrated circuits; circuit CAD; clocks; embedded systems; field programmable gate arrays; integrated circuit design; integrated circuit interconnections; integrated circuit manufacture; integrated circuit reliability; lab-on-a-chip; logic design; low-power electronics; multiprocessing systems; nanoelectronics; network routing; system-on-chip; three-dimensional integrated circuits; 3D IC; 3D MPSoC; FPGA synthesis; analog functionality; analog signal verification; beyond-die design; circuit reliability; clock distribution; computer aided design; design optimization; device reliability; digital microfluidic biochip; digital system; embedded system; fault detection; global routing; hardware Trojan; interconnect analysis; logic synthesis; low power design; manufacturing-aware design; many-core system; memory system scheduling; mixed signal verification; nanometer CMOS; organic electronics; physical synthesis; power grid; power optimization; power-sensitive condition; process variation; quality analysis; reliability analysis; synchronous system; system estimation; system evaluation; system level design; thermal-aware architecture; timing analysis; yield analysis;
Conference_Titel :
Computer-Aided Design (ICCAD), 2010 IEEE/ACM International Conference on
Conference_Location :
San Jose, CA
Print_ISBN :
978-1-4244-8193-4
DOI :
10.1109/ICCAD.2010.5654352
