• DocumentCode
    3380608
  • Title

    Rapid and automated grain orientation and grain boundary analysis in nanoscale copper interconnects

  • Author

    Ganesh, K.J. ; Rajasekhara, S. ; Bultreys, D. ; Ferreira, P.J.

  • Author_Institution
    Mater. Sci. & Eng. Program, Univ. of Texas - Austin, Austin, TX, USA
  • fYear
    2011
  • fDate
    10-14 April 2011
  • Abstract
    A combination of diffraction scanning transmission electron microscopy (D-STEM) and automated precession microscopy is used to obtain orientation information from 108 copper grains in 120 nm wide copper interconnect lines. Grain boundary analysis based on this orientation data reveals that Σ3n (n = 1, 2) boundaries are predominant in these lines. Finite element analysis reveals regions of high and low stresses within the copper microstructure.
  • Keywords
    copper; diffraction; finite element analysis; grain boundaries; interconnections; nanostructured materials; scanning-transmission electron microscopy; Cu; D-STEM; automated grain orientation; copper microstructure; diffraction scanning transmission electron microscopy; finite element analysis; grain boundary analysis; nanoscale copper interconnect line; size 120 mm; Copper; Diffraction; Finite element methods; Grain boundaries; Microscopy; Microstructure; Stress;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Reliability Physics Symposium (IRPS), 2011 IEEE International
  • Conference_Location
    Monterey, CA
  • ISSN
    1541-7026
  • Print_ISBN
    978-1-4244-9113-1
  • Electronic_ISBN
    1541-7026
  • Type

    conf

  • DOI
    10.1109/IRPS.2011.5784524
  • Filename
    5784524
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=3380608