DocumentCode
3380721
Title
AlGaN/GaN-on-SiC HEMT Technology Status
Author
Smith, R. Peter ; Sheppard, S. ; Wu, Y.F. ; Heikman, S. ; Wood, S. ; Pribble, W. ; Milligan, J.W.
Author_Institution
Cree, Inc., Durham, NC
fYear
2008
fDate
12-15 Oct. 2008
Firstpage
1
Lastpage
4
Abstract
GaN-based devices offer significant advantages for next generation military and commercial systems. Military systems benefit from high power densities of 4 to 7 W/mm depending on bias conditions along with efficiencies over 60% at frequencies through X-band, and commercial systems take advantage of excellent linearity as well. In this paper, we will review a number of commercial products that only GaN technology can achieve. In addition to narrow-band circuits for highly linear commercial applications, results will be shown for two commercial GaN MMIC products that have been developed for general-purpose applications in the 2.5-6.0 GHz and DC-6.0 GHz bands. Additionally, results are shown for a 2-stage high efficiency S-band switch mode amplifier operating from 3.1-3.5 GHz. Significant progress has also been made in the development of 100-mm SiC substrates. Micropipe densities as low as 2.5 cm-2 have been demonstrated for 100-mm HPSI substrates.
Keywords
III-V semiconductors; MMIC; UHF amplifiers; aluminium compounds; gallium compounds; high electron mobility transistors; microwave amplifiers; military systems; semiconductor devices; silicon compounds; wide band gap semiconductors; AlGaN-GaN; HEMT technology status; HPSI substrates; MMIC products; S-band switch mode amplifier; SiC; X-band; commercial systems; frequency 2.5 GHz to 6.0 GHz; micropipe densities; military systems; narrow-band circuits; semiconductor devices; size 100 nm; Aluminum gallium nitride; Circuits; Frequency; Gallium nitride; HEMTs; Linearity; MMICs; Narrowband; Silicon carbide; Switches;
fLanguage
English
Publisher
ieee
Conference_Titel
Compound Semiconductor Integrated Circuits Symposium, 2008. CSIC '08. IEEE
Conference_Location
Monterey, CA
ISSN
1550-8781
Print_ISBN
978-1-4244-1939-5
Electronic_ISBN
1550-8781
Type
conf
DOI
10.1109/CSICS.2008.57
Filename
4674512
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