Electrical characterization of quad-flat-paks (QFPs) using frequency-domain techniques

Author

Fraser, Arthur ; Bell, Orlando ; Strouth, Tom

Author_Institution

Giga Test Lab. Inc., Cupertino, CA, USA

fYear

1995

fDate

2-4 Oct 1995

Firstpage

102

Lastpage

104

Abstract

Quad-Flat-Paks (QFPs) are difficult to measure and model at high frequencies because they lack power and ground planes. By fixturing the package and establishing a ground reference the problem becomes much more manageable. Measurements are made with a network analyzer because it clearly reveals high-frequency effects. By measuring and simulating the different configurations (open, short, and thru) all the elements in the circuit can be extracted with great accuracy

Keywords

S-parameters; UHF measurement; crosstalk; frequency-domain analysis; high-frequency transmission line measurement; inductance measurement; microwave measurement; network analysers; packaging; printed circuit testing; 50 MHz to 5.05 GHz; QFP; S-parameter measurement; Smith chart; circuit board fixtures; circuit elements; configuration simulation; crosstalk response; dielectric loss; electrical characterization; frequency-domain techniques; ground reference; high-frequency effects; network analyzer; package fixturing; quad-flat-paks; resonance; self inductance; skin effect; Circuit simulation; Circuit topology; Crosstalk; Dielectric loss measurement; Dielectric measurements; Electronics packaging; Fixtures; Frequency measurement; Inductance; Lead;

fLanguage

English

Publisher

ieee

Conference_Titel

Electrical Performance of Electronic Packaging, 1995

Conference_Location

Portland, OR

Print_ISBN

0-7803-3034-X

Type

conf

DOI

10.1109/EPEP.1995.524864

Filename

524864