Title :
A method for on-chip interconnect characterization
Author :
Glaser, A.W. ; Steer, M.B. ; Shedd, G.M. ; Russell, P.E. ; Franzon, P.D.
Author_Institution :
Dept. of Electr. & Comput. Eng., North Carolina State Univ., Raleigh, NC, USA
Abstract :
We present and novel method for the measurement of interconnect capacitance, atomic capacitance microscopy. We also present VLSI structures which allow correlation of ACM and traditional (VNA, TDR, direct capacitance) measurement techniques
Keywords :
VLSI; atomic force microscopy; capacitance measurement; integrated circuit interconnections; integrated circuit measurement; VLSI structures; atomic capacitance microscopy; atomic force microscopy; capacitance measurement technique; interconnect parasitics; on-chip interconnect characterization; Atomic force microscopy; Atomic measurements; Capacitance measurement; Force measurement; Instruments; Integrated circuit interconnections; Predictive models; Probes; Very large scale integration; Voltage;
Conference_Titel :
Electrical Performance of Electronic Packaging, 1995
Conference_Location :
Portland, OR
Print_ISBN :
0-7803-3034-X
DOI :
10.1109/EPEP.1995.524866
