• DocumentCode
    3381150
  • Title

    A method for on-chip interconnect characterization

  • Author

    Glaser, A.W. ; Steer, M.B. ; Shedd, G.M. ; Russell, P.E. ; Franzon, P.D.

  • Author_Institution
    Dept. of Electr. & Comput. Eng., North Carolina State Univ., Raleigh, NC, USA
  • fYear
    1995
  • fDate
    2-4 Oct 1995
  • Firstpage
    108
  • Lastpage
    110
  • Abstract
    We present and novel method for the measurement of interconnect capacitance, atomic capacitance microscopy. We also present VLSI structures which allow correlation of ACM and traditional (VNA, TDR, direct capacitance) measurement techniques
  • Keywords
    VLSI; atomic force microscopy; capacitance measurement; integrated circuit interconnections; integrated circuit measurement; VLSI structures; atomic capacitance microscopy; atomic force microscopy; capacitance measurement technique; interconnect parasitics; on-chip interconnect characterization; Atomic force microscopy; Atomic measurements; Capacitance measurement; Force measurement; Instruments; Integrated circuit interconnections; Predictive models; Probes; Very large scale integration; Voltage;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical Performance of Electronic Packaging, 1995
  • Conference_Location
    Portland, OR
  • Print_ISBN
    0-7803-3034-X
  • Type

    conf

  • DOI
    10.1109/EPEP.1995.524866
  • Filename
    524866
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=3381150