Title :
Frequency domain measurements of VSPA: a novel packaging technology
Author :
Hao, J. ; Richter, A. ; Laskar, J. ; Swaminathan, M. ; Mosley, J.
Author_Institution :
Sch. of Electr. Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
Abstract :
This paper describes the modeling and measurement of VSPA, a very small peripheral array package developed by Archistrat containing 320 pins with a size of 27 mm×27 mm. The analysis covers a frequency range of 20 MHz-3 GHz, includes analytical calculations, simulations, measurements, leading to a lumped model representation of the package parasitics
Keywords :
frequency-domain analysis; integrated circuit measurement; integrated circuit modelling; integrated circuit packaging; 20 MHz to 3 GHz; 27 mm; Archistrat; IC packaging; VSPA; analytical calculations; frequency domain measurements; lumped model; package parasitics; packaging technology; very small peripheral array package; Analytical models; Frequency domain analysis; Frequency measurement; Packaging; Pins; Size measurement;
Conference_Titel :
Electrical Performance of Electronic Packaging, 1995
Conference_Location :
Portland, OR
Print_ISBN :
0-7803-3034-X
DOI :
10.1109/EPEP.1995.524874
