DocumentCode
3381278
Title
Frequency domain measurements of VSPA: a novel packaging technology
Author
Hao, J. ; Richter, A. ; Laskar, J. ; Swaminathan, M. ; Mosley, J.
Author_Institution
Sch. of Electr. Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
fYear
1995
fDate
2-4 Oct 1995
Firstpage
133
Lastpage
136
Abstract
This paper describes the modeling and measurement of VSPA, a very small peripheral array package developed by Archistrat containing 320 pins with a size of 27 mm×27 mm. The analysis covers a frequency range of 20 MHz-3 GHz, includes analytical calculations, simulations, measurements, leading to a lumped model representation of the package parasitics
Keywords
frequency-domain analysis; integrated circuit measurement; integrated circuit modelling; integrated circuit packaging; 20 MHz to 3 GHz; 27 mm; Archistrat; IC packaging; VSPA; analytical calculations; frequency domain measurements; lumped model; package parasitics; packaging technology; very small peripheral array package; Analytical models; Frequency domain analysis; Frequency measurement; Packaging; Pins; Size measurement;
fLanguage
English
Publisher
ieee
Conference_Titel
Electrical Performance of Electronic Packaging, 1995
Conference_Location
Portland, OR
Print_ISBN
0-7803-3034-X
Type
conf
DOI
10.1109/EPEP.1995.524874
Filename
524874
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