• DocumentCode
    3381321
  • Title

    Flexible PCB Vertical Thermopile IR Sensor

  • Author

    Lindeberg, Mikael ; Yousef, Hanna ; Rödjegård, Henrik ; Martin, Hans ; Hjort, Klas

  • Author_Institution
    Uppsala Univ., Uppsala
  • fYear
    2007
  • fDate
    10-14 June 2007
  • Firstpage
    2275
  • Lastpage
    2278
  • Abstract
    We present the design, fabrication and characterization of vertical thermopile infra-red (IR) sensors. The sensors are produced in batches in a standard flexible printed circuit board (flex PCB) material. The vertical design opens up for large area detection and longer thermopile chains. The sensors consist of series of 88 vertically interconnected thermocouples in a 75 mum thick polyimide foil (Kapton HNtrade). The sensors showed a voltage response to an IR pulse of 1.2 V/(W/mm2).
  • Keywords
    flexible electronics; infrared detectors; optical sensors; printed circuits; temperature sensors; thermocouples; thermopiles; flexible PCB vertical thermopile IR sensor; flexible printed circuit board material; infra-red sensors; polyimide foil; size 75 mum; thermopile chains; vertically interconnected thermocouples; voltage response; Infrared sensors; Integrated circuit interconnections; Lithography; Nickel; Polyimides; Sensor phenomena and characterization; Thermal conductivity; Thermal sensors; Wet etching; Wires; IR sensor; flexible printed circuit boards; through-hole via interconnects; vertical thermopiles;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Solid-State Sensors, Actuators and Microsystems Conference, 2007. TRANSDUCERS 2007. International
  • Conference_Location
    Lyon
  • Print_ISBN
    1-4244-0842-3
  • Electronic_ISBN
    1-4244-0842-3
  • Type

    conf

  • DOI
    10.1109/SENSOR.2007.4300623
  • Filename
    4300623