Title :
Rectangular 3D wirelength distribution models
Author :
Nain, Rajeev K. ; Ray, Rajarshi ; Chrzanowska-Jeske, Malgorzata
Author_Institution :
Dept. of Electr. & Comput. Eng., Portland State Univ., Portland, OR
fDate :
Aug. 31 2008-Sept. 3 2008
Abstract :
We have extended three existing 3D wirelength distribution models, initially developed for square modules, to handle rectangular 3D blocks. Our extended models enable the stochastic wirelength prediction from 3D chip level to 3D block level. We have performed comparative and qualitative studies of these newly developed rectangular models. Experimental results provide a comparative picture in terms of efficiency and computation time for these models. In addition, we have studied the impact of aspect ratio on the total wirelength and the overall distribution models for the first time. Our proposed work will be extremely useful in the fast estimation of wirelength in the interconnect-centric 3D floorplanning.
Keywords :
circuit layout CAD; integrated circuit interconnections; integrated circuit layout; wires (electric); 3D block level; 3D chip level; interconnect-centric 3D floorplanning; rectangular 3D wirelength distribution models; stochastic wirelength prediction; Active matrix technology; Delay; Guidelines; Integrated circuit interconnections; Logic arrays; Mathematical model; Predictive models; Shape; Stochastic processes; Wires;
Conference_Titel :
Electronics, Circuits and Systems, 2008. ICECS 2008. 15th IEEE International Conference on
Conference_Location :
St. Julien´s
Print_ISBN :
978-1-4244-2181-7
Electronic_ISBN :
978-1-4244-2182-4
DOI :
10.1109/ICECS.2008.4674803
