Rectangular 3D wirelength distribution models

Author

Nain, Rajeev K. ; Ray, Rajarshi ; Chrzanowska-Jeske, Malgorzata

Author_Institution

Dept. of Electr. & Comput. Eng., Portland State Univ., Portland, OR

fYear

2008

fDate

Aug. 31 2008-Sept. 3 2008

Firstpage

109

Lastpage

112

Abstract

We have extended three existing 3D wirelength distribution models, initially developed for square modules, to handle rectangular 3D blocks. Our extended models enable the stochastic wirelength prediction from 3D chip level to 3D block level. We have performed comparative and qualitative studies of these newly developed rectangular models. Experimental results provide a comparative picture in terms of efficiency and computation time for these models. In addition, we have studied the impact of aspect ratio on the total wirelength and the overall distribution models for the first time. Our proposed work will be extremely useful in the fast estimation of wirelength in the interconnect-centric 3D floorplanning.

Keywords

circuit layout CAD; integrated circuit interconnections; integrated circuit layout; wires (electric); 3D block level; 3D chip level; interconnect-centric 3D floorplanning; rectangular 3D wirelength distribution models; stochastic wirelength prediction; Active matrix technology; Delay; Guidelines; Integrated circuit interconnections; Logic arrays; Mathematical model; Predictive models; Shape; Stochastic processes; Wires;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronics, Circuits and Systems, 2008. ICECS 2008. 15th IEEE International Conference on

Conference_Location

St. Julien´s

Print_ISBN

978-1-4244-2181-7

Electronic_ISBN

978-1-4244-2182-4

Type

conf

DOI

10.1109/ICECS.2008.4674803

Filename

4674803