DocumentCode
3381343
Title
FREQUENCY DOMAIN MEASUREMENTS OF VSPA: A NOVEL PACKAGING TECHNOLOGY
Author
Hao, J. ; Richter, A. ; Laskar, J. ; Swaminathan, M. ; Mosley, J.
fYear
1995
fDate
2-4 Oct 1995
Firstpage
134
Keywords
Costs; Electronics packaging; Frequency domain analysis; Frequency measurement; Inductance; Integrated circuit packaging; Pins; Plastic packaging; Space heating; Thermal conductivity;
fLanguage
English
Publisher
ieee
Conference_Titel
Electrical Performance of Electronic Packaging, 1995
Print_ISBN
0-7803-3034-X
Type
conf
DOI
10.1109/EPEP.1995.524875
Filename
524875
Link To Document