DocumentCode
3381377
Title
Optoelectronic packaging for data communications: Optical and electrical modeling needs for cost-effective designs
Author
Jackson, Kenneth P.
Author_Institution
IBM Corp., Rochester, MN, USA
fYear
1995
fDate
2-4 Oct 1995
Firstpage
143
Lastpage
145
Abstract
Fiber-optic data links, based on CD-type short wavelength (λ=780 nm) lasers and multimode optical fibers are beginning to emerge as viable solutions for high performance, low cost computer interconnects. This presentation will describe the technology and discuss some key areas where better modeling is needed to enable more precise cost/performance trade-offs to be made
Keywords
data communication; optical fibre communication; optical fibres; packaging; 780 nm; CD-type short wavelength lasers; cost-effective designs; cost/performance trade-offs; data communications; electrical modeling; fiber-optic data links; low cost computer interconnects; multimode optical fibers; optoelectronic packaging; Costs; Data communication; Fiber lasers; High performance computing; Laser modes; Optical computing; Optical fiber communication; Optical fibers; Optical interconnections; Packaging;
fLanguage
English
Publisher
ieee
Conference_Titel
Electrical Performance of Electronic Packaging, 1995
Conference_Location
Portland, OR
Print_ISBN
0-7803-3034-X
Type
conf
DOI
10.1109/EPEP.1995.524877
Filename
524877
Link To Document