DocumentCode
3381427
Title
Leadless 432-pin package and solderless socket for a 622 MHz system
Author
Loos, J.S.
Author_Institution
AT&T Bell Labs., Naperville, IL, USA
fYear
1995
fDate
2-4 Oct 1995
Firstpage
149
Lastpage
151
Abstract
This paper presents the design and performance of a leadless MCM-D electronic package with the following attributes: (1) 432-pin land-grid I/O array, (2) mountable/demountable to its printed circuit board by means of a solderless socket, (3) signal speeds above 1 GHz, and (4) up to 25 W dissipated using forced-air cooling
Keywords
cooling; multichip modules; printed circuit accessories; 1 GHz; 25 W; 622 MHz; MCM-D electronic package; PCB demountable; PCB mountable; forced-air cooling; land-grid I/O array; leadless 432-pin package; solderless socket; Assembly; Capacitors; Circuits; Gallium arsenide; Impedance; Lead; Resistors; Semiconductor device packaging; Sockets; Wire;
fLanguage
English
Publisher
ieee
Conference_Titel
Electrical Performance of Electronic Packaging, 1995
Conference_Location
Portland, OR
Print_ISBN
0-7803-3034-X
Type
conf
DOI
10.1109/EPEP.1995.524879
Filename
524879
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