Title :
Leadless 432-pin package and solderless socket for a 622 MHz system
Author_Institution :
AT&T Bell Labs., Naperville, IL, USA
Abstract :
This paper presents the design and performance of a leadless MCM-D electronic package with the following attributes: (1) 432-pin land-grid I/O array, (2) mountable/demountable to its printed circuit board by means of a solderless socket, (3) signal speeds above 1 GHz, and (4) up to 25 W dissipated using forced-air cooling
Keywords :
cooling; multichip modules; printed circuit accessories; 1 GHz; 25 W; 622 MHz; MCM-D electronic package; PCB demountable; PCB mountable; forced-air cooling; land-grid I/O array; leadless 432-pin package; solderless socket; Assembly; Capacitors; Circuits; Gallium arsenide; Impedance; Lead; Resistors; Semiconductor device packaging; Sockets; Wire;
Conference_Titel :
Electrical Performance of Electronic Packaging, 1995
Conference_Location :
Portland, OR
Print_ISBN :
0-7803-3034-X
DOI :
10.1109/EPEP.1995.524879
