Title :
Measurement based characterization of RF-IC packages
Author :
Kollipara, R.T. ; Tripathi, A. ; Williams, J. ; Tripathi, V.K.
Author_Institution :
Dept. of Electr. & Comput. Eng., Oregon State Univ., Corvallis, OR, USA
Abstract :
Low cost and small lead frame packages are characterized for RF wireless applications in terms of self and mutual inductances and capacitances associated with the package pins. A multiport measurement scheme to extract these self and mutual element values is presented together with examples of typical low cost RF-IC packages
Keywords :
capacitance measurement; inductance measurement; integrated circuit measurement; integrated circuit packaging; multiport networks; RF-IC packages; capacitance; lead frame; multiport measurement; mutual inductance; self inductance; wireless; Capacitance; Costs; Couplings; Electromagnetic measurements; Fixtures; Integrated circuit packaging; Measurement techniques; Pins; Radio frequency; Voltage;
Conference_Titel :
Electrical Performance of Electronic Packaging, 1995
Conference_Location :
Portland, OR
Print_ISBN :
0-7803-3034-X
DOI :
10.1109/EPEP.1995.524883
