• DocumentCode
    3381519
  • Title

    Latency-aware mapping for 3D NoC using rank-based multi-objective genetic algorithm

  • Author

    Wang, Jiawen ; Li, Li ; Pan, Hongbing ; He, Shuzhuan ; Zhang, Rong

  • Author_Institution
    Inst. of VLSI Design, Nanjing Univ., Nanjing, China
  • fYear
    2011
  • fDate
    25-28 Oct. 2011
  • Firstpage
    413
  • Lastpage
    416
  • Abstract
    Three dimensional network-on-chip (3D NoC) has been suggested as a potential alternative to solve insurmountable problems in 2D field such as global wire length and packet latency for many years. And the mapping problem plays an import role in 3D NoC design which will have a great influence on overall system performance. In this paper, we mainly focus on the latency-aware mapping for 3D NoC. Differing from the conventional mapping algorithms, the packet latency under no congestion and congestion are both taken into account. Since more than one metrics are considered in this situation, instead of the traditional single-objective genetic algorithm, a rank-based multi-objective genetic algorithm (RMGA) is adopted in our work to explore the optimal approximation of the Pareto-front efficiently and accurately. To evaluate the proposed algorithm, the video object plane decoder (VOPD) is used as a case study. The results show that the RMGA can obtain the approximate Pareto-front well and compared with the best results chosen from random generated solutions, the RMGA can achieve an improvement of 24.4% and 15.4% for latency metrics under no congestion and congestion respectively.
  • Keywords
    Pareto analysis; genetic algorithms; network-on-chip; three-dimensional integrated circuits; 3D NoC; Pareto-front; latency-aware mapping; packet latency; rank-based multiobjective genetic algorithm; single-objective genetic algorithm; three dimensional network-on-chip; video object plane decoder; Biological cells; Three dimensional displays; Visualization;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    ASIC (ASICON), 2011 IEEE 9th International Conference on
  • Conference_Location
    Xiamen
  • ISSN
    2162-7541
  • Print_ISBN
    978-1-61284-192-2
  • Electronic_ISBN
    2162-7541
  • Type

    conf

  • DOI
    10.1109/ASICON.2011.6157209
  • Filename
    6157209