Title :
Solderless interconnects for 3D microwave packaging
Author :
Wooldridge, John
Author_Institution :
Hughes Aircraft Co., Los Angeles, CA, USA
Abstract :
The electrical performance parameters of solderless interconnects and the associated package development are reviewed for a 3D X-band transmit/receive module. The microwave performance over 7-18 GHz, as well as the environmental performance, are discussed with both theoretical and actual measurements
Keywords :
integrated circuit interconnections; integrated circuit packaging; microwave integrated circuits; modules; 3D microwave packaging; 7 to 18 GHz; X-band; electrical performance parameters; environmental performance; microwave performance; package development; solderless interconnects; transmit/receive module; Connectors; Humidity; Manufacturing; Microwave measurements; Packaging; Stripline; Transmission line matrix methods; Transmission line measurements; Tungsten; Vibration measurement;
Conference_Titel :
Electrical Performance of Electronic Packaging, 1995
Conference_Location :
Portland, OR
Print_ISBN :
0-7803-3034-X
DOI :
10.1109/EPEP.1995.524888
