Title :
Effect of package shape on spurious coupling among microstrip discontinuities
Author :
Gupta, K.C. ; Cebi, Haki ; Thng, Cheok
Author_Institution :
Dept. of Electr. & Comput. Eng., Colorado Univ., Boulder, CO, USA
Abstract :
Effects of a metallic package on the performance of a microstrip circuit are attributed mainly to the modifications of spurious couplings among various discontinuities. This paper describes a method for computing the effect of the package shape on the interactions among discontinuities
Keywords :
MMIC; integrated circuit design; integrated circuit packaging; microstrip circuits; microstrip discontinuities; MMICs; metallic package; microstrip circuit; microstrip discontinuities; package shape; spurious coupling; Coupling circuits; Current distribution; Design engineering; Electromagnetic fields; Magnetic circuits; Magnetic separation; Microstrip; Packaging; Shape; Telephony;
Conference_Titel :
Electrical Performance of Electronic Packaging, 1995
Conference_Location :
Portland, OR
Print_ISBN :
0-7803-3034-X
DOI :
10.1109/EPEP.1995.524890
