DocumentCode
3381594
Title
Effect of package shape on spurious coupling among microstrip discontinuities
Author
Gupta, K.C. ; Cebi, Haki ; Thng, Cheok
Author_Institution
Dept. of Electr. & Comput. Eng., Colorado Univ., Boulder, CO, USA
fYear
1995
fDate
2-4 Oct 1995
Firstpage
184
Lastpage
187
Abstract
Effects of a metallic package on the performance of a microstrip circuit are attributed mainly to the modifications of spurious couplings among various discontinuities. This paper describes a method for computing the effect of the package shape on the interactions among discontinuities
Keywords
MMIC; integrated circuit design; integrated circuit packaging; microstrip circuits; microstrip discontinuities; MMICs; metallic package; microstrip circuit; microstrip discontinuities; package shape; spurious coupling; Coupling circuits; Current distribution; Design engineering; Electromagnetic fields; Magnetic circuits; Magnetic separation; Microstrip; Packaging; Shape; Telephony;
fLanguage
English
Publisher
ieee
Conference_Titel
Electrical Performance of Electronic Packaging, 1995
Conference_Location
Portland, OR
Print_ISBN
0-7803-3034-X
Type
conf
DOI
10.1109/EPEP.1995.524890
Filename
524890
Link To Document