DocumentCode
3381714
Title
Efficient 3-D series impedance extraction using effective internal impedance
Author
Lee, Beom-Taek ; Tuncer, Emre ; Neikirk, Dean P.
Author_Institution
Dept. of Electr. & Comput. Eng., Texas Univ., Austin, TX, USA
fYear
1995
fDate
2-4 Oct 1995
Firstpage
220
Lastpage
222
Abstract
The effective internal impedance approach, combined with the current-filament technique, has been shown to be a very efficient way to extract frequency dependent resistance and inductance of uniform interconnects. In this study, we show that this approach can be extended to find the series impedance of three dimensional structures. A microstrip bend is studied as a simple example
Keywords
electric impedance; microstrip discontinuities; waveguide discontinuities; 3D series impedance; current-filament technique; effective internal impedance; frequency dependent resistance; inductance; interconnects; microstrip bend; three dimensional structures; Conductors; Conformal mapping; Finite difference methods; Frequency dependence; Inductance; Integrated circuit interconnections; Packaging; Skin; Surface impedance; Surface resistance;
fLanguage
English
Publisher
ieee
Conference_Titel
Electrical Performance of Electronic Packaging, 1995
Conference_Location
Portland, OR
Print_ISBN
0-7803-3034-X
Type
conf
DOI
10.1109/EPEP.1995.524899
Filename
524899
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