A new approach to signal integrity analysis of high-speed packaging

Author

Yuzhe Chen ; Zhaoqing Chen ; Wu, Zhongliua ; Danwei Xue ; Fang, Jiayuan

Author_Institution

Dept. of Electr. Eng., State Univ. of New York, Binghamton, NY, USA

fYear

1995

fDate

2-4 Oct 1995

Firstpage

235

Lastpage

238

Abstract

A signal integrity analysis program that simultaneously performs the electromagnetic field simulation and the circuit simulation is introduced in this paper. The electromagnetic field simulation algorithms are based on special geometric features of packaging structures and can run two to four orders of magnitude faster than general-purpose electromagnetic tools. The use of the distributed circuit simulation technique drastically reduces the simulation time for lumped circuit components. This program can promptly simulate practical packages of tens of power/ground planes and thousands of vias and signal traces, while considering signal integrity problems such as signal delay, distortion, reflection, coupling, and power/ground noise. The accuracy of the simulated results is verified by measurements

Keywords

circuit analysis computing; distributed parameter networks; electromagnetic field theory; packaging; algorithms; distributed circuit simulation; electromagnetic field simulation; high-speed packaging; noise; power/ground planes; signal coupling; signal delay; signal distortion; signal integrity analysis; signal reflection; vias; Analytical models; Circuit simulation; Delay; Distortion; Electromagnetic analysis; Electromagnetic fields; Packaging; Performance analysis; Signal analysis; Solid modeling;

fLanguage

English

Publisher

ieee

Conference_Titel

Electrical Performance of Electronic Packaging, 1995

Conference_Location

Portland, OR

Print_ISBN

0-7803-3034-X

Type

conf

DOI

10.1109/EPEP.1995.524903

Filename

524903