DocumentCode :
3382036
Title :
Behaviors and physical degradation of HfSiON MOSFET linked to strained CESL performance booster
Author :
Bae, Kidan ; Jin, Minjung ; Lim, Hajin ; Hwang, Lira ; Shin, Dongseok ; Park, Junekyun ; Heo, Jinchul ; Lee, Jongho ; Do, Jinho ; Bae, Ilchan ; Jeon, Chulhee ; Park, Jongwoo
Author_Institution :
Technol. Reliability, Samsung Electron., Yongin, South Korea
fYear :
2011
fDate :
10-14 April 2011
Abstract :
The propensity of HCI and BTI degradation of HfSiON MOSFET on strained SiN-CESL performance booster is meticulously investigated. It is found that HCI and BTI lifetime of HfO based n/p MOSFET devices depend on hydrogen, initial Dit and plasma charging inherently related to the stress type of CESL fabricated with PECVD. In case for tensile CESL, n/p MOSFET devices far exceed reliability targets for both HCI and BTI. While compressive CESL on n/p MOSFET drastically depresses HCI and BTI lifetime.
Keywords :
MOSFET; hafnium compounds; plasma CVD; semiconductor device reliability; silicon compounds; stress effects; BTI degradation; HCI degradation; HfSiON; MOSFET behavior degradation; PECVD; hydrogen; initial Dit; n-MOSFET device; p MOSFET device; physical degradation; plasma charging; reliability target; strained SiN-CESL performance booster; tensile CESL; Human computer interaction; MOS devices; MOSFET circuits; Plasmas; Reliability; Silicon; Stress; BTI; CESL; CP; FTIR; HCI; Plasma; Reliability;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Reliability Physics Symposium (IRPS), 2011 IEEE International
Conference_Location :
Monterey, CA
ISSN :
1541-7026
Print_ISBN :
978-1-4244-9113-1
Electronic_ISBN :
1541-7026
Type :
conf
DOI :
10.1109/IRPS.2011.5784592
Filename :
5784592
Link To Document :
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