• DocumentCode
    3382067
  • Title

    Comparative analysis of power yield improvement under process variation of sub-threshold flip-flops

  • Author

    Mostafa, Hassan ; Anis, Mohab ; Elmasry, Mohamed

  • Author_Institution
    Dept. of Electr. & Comput. Eng., Univ. of Waterloo, Waterloo, ON, Canada
  • fYear
    2010
  • fDate
    May 30 2010-June 2 2010
  • Firstpage
    1739
  • Lastpage
    1742
  • Abstract
    In low power synchronous systems, sub-threshold flip-flops are used to reduce the total power dissipation. Moreover, process variations create a large variability in the flip-flop power in scaled technologies impacting the power yield, especially, for sub-threshold operation. This paper presents an analysis of power yield improvement of four commonly used flip-flops under process variations. These flip-flops are designed using STMicroelectronics 65-nm CMOS technology. The analyzed flip-flops are compared for delay, energy, and energy-delay product (EDP) overheads to achieve this power yield improvement. The analysis shows that the sense amplifier based flip flop (SA-FF) has the lowest overheads while the modified clocked CMOS master slave flip-flop (M-C2MOS-MSFF) exhibits the largest overheads, and correspondingly, it is not recommended for sub-threshold operation.
  • Keywords
    CMOS integrated circuits; flip-flops; logic design; low-power electronics; CMOS master slave flip-flop; energy-delay product; low power synchronous systems; power yield improvement; process variation; sense amplifier based flip flop; size 65 nm; sub-threshold flip-flops; CMOS technology; Circuit simulation; Clocks; Design methodology; Flip-flops; Latches; Master-slave; Power dissipation; Random processes; Threshold voltage;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Circuits and Systems (ISCAS), Proceedings of 2010 IEEE International Symposium on
  • Conference_Location
    Paris
  • Print_ISBN
    978-1-4244-5308-5
  • Electronic_ISBN
    978-1-4244-5309-2
  • Type

    conf

  • DOI
    10.1109/ISCAS.2010.5537544
  • Filename
    5537544