• DocumentCode
    3382141
  • Title

    Progress in advanced metallization technology at Fraunhofer ISE

  • Author

    Glunz, S.W. ; Aleman, M. ; Bartsch, J. ; Bay, N. ; Bayer, K. ; Bergander, R. ; Filipovic, A. ; Greil, S. ; Grohe, A. ; Hörteis, M. ; Knorz, A. ; Menkö, M. ; Mette, A. ; Pysch, D. ; Radtke, V. ; Richter, P. ; Rudolph, D. ; Rublack, T. ; Schetter, C. ; Schm

  • Author_Institution
    Fraunhofer Institute for Solar Energy Systems (ISE), Heidenhofstr. 2, D-79110 Freiburg, Germany
  • fYear
    2008
  • fDate
    11-16 May 2008
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    Fraunhofer ISE´s concept for an advanced metallization of silicon solar cells is based on a two-step process: the deposition of a seed layer to form a mechanical and electrical contact and the subsequent thickening of this seed layer by a plating step, preferably by light-induced plating (LIP). The concept of a multi-layer metallization is used for most of the relevant high-efficiency cell types in industry. The main advantage of this concept is that each layer can be optimized individually, i.e. the seed layer to achieve an optimal electrical and mechanical contact and the plated layer in terms of high lateral conductivity and good solderability. Solar cells results with seed layers fabricated by aerosol printing, chemical Ni plating on cells with a laser-structured dielectric layer and laser-enhanced Ni plating are presented.
  • Keywords
    Aerosols; Chemical lasers; Conductivity; Contacts; Dielectrics; Metallization; Metals industry; Photovoltaic cells; Printing; Silicon;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Photovoltaic Specialists Conference, 2008. PVSC '08. 33rd IEEE
  • Conference_Location
    San Diego, CA, USA
  • ISSN
    0160-8371
  • Print_ISBN
    978-1-4244-1640-0
  • Electronic_ISBN
    0160-8371
  • Type

    conf

  • DOI
    10.1109/PVSC.2008.4922746
  • Filename
    4922746