DocumentCode
3382218
Title
A study of second saturation effect of OPTVLD NMOS
Author
Du, Wenfang ; Chen, Xingbi
Author_Institution
State Key Labs. of Electron. Thin Films & Integrated Devices, Univ. of Electron. Sci. & Technol. of China, Chengdu, China
fYear
2011
fDate
25-28 Oct. 2011
Firstpage
551
Lastpage
554
Abstract
A detail analysis of the mechanism of output characteristic of OPTimized Variation Lateral Doping (OPTVLD) N-type MOS is presented in this paper. While a first current saturation of channel current is caused by the parasitic Junction FET (JFET), a second saturation is found in the state of high level drain current-voltage, which is explained by the enhancement of drain current with the increasing of drain voltage at high gate voltage due to that the carriers introduced by current modulate the electric field and cause intense impact ionization effect. It is expected that the analysis presented here can be used to improve the output characteristic of OPTVLD NMOS.
Keywords
MOS integrated circuits; field effect transistors; impact ionisation; OPTVLD N-type MOS; OPTVLD NMOS; channel current; current saturation; drain current enhancement; drain voltage; electric field; high gate voltage; high level drain current-voltage; impact ionization effect; optimized variation lateral doping; output characteristic; parasitic junction FET; second saturation effect; JFETs; MOS devices; Switches;
fLanguage
English
Publisher
ieee
Conference_Titel
ASIC (ASICON), 2011 IEEE 9th International Conference on
Conference_Location
Xiamen
ISSN
2162-7541
Print_ISBN
978-1-61284-192-2
Electronic_ISBN
2162-7541
Type
conf
DOI
10.1109/ASICON.2011.6157264
Filename
6157264
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