• DocumentCode
    3382365
  • Title

    [Rear surface passivation of interdigitated back contact silicon heterojunction solar cell and 2D simulation study

  • Author

    Lu, Meijun ; Das, Ujjwal ; Bowden, Stuart ; Birkmire, Robert

  • Author_Institution
    Institute of Energy Conversion, University of Delaware, Newark, 19716, USA
  • fYear
    2008
  • fDate
    11-16 May 2008
  • Firstpage
    1
  • Lastpage
    5
  • Abstract
    Rear surface passivation by deposited intrinsic amorphous silicon (a-Si) buffer layer in interdigitated back contact silicon heterojunction (IBC-SHJ) solar cells significantly improves open circuit voltage (VOC) and short circuit current (JSC) but can lead to very low fill factor (FF) with an “S” shape J-V curve. In this paper, methods to optimize IBC-SHJ solar cell with improved FF are discussed and guided by two-dimensional numerical modelling. Two approaches to improve FF by modifying the buffer layer are evaluated: (1) increased conductivity, or (2) reduced band gap. Experimental results show that replacing the intrinsic a-Si layer in emitter with lightly doped p-type a-Si layer greatly improves fill factor, which is consistent with modelling prediction. However, the VOC and JSC are limited by the high recombination velocity of the unpassivated gap between the emitter and contact strips. The importance of gap passivation to achieve high efficiency in the IBC-SHJ structure was verified by 2D device simulation. The band gap of the intrinsic buffer layers have been reduced by changing the deposition conditions without substantially decreasing the passivation quality.
  • Keywords
    Amorphous silicon; Buffer layers; Circuit simulation; Heterojunctions; Passivation; Photonic band gap; Photovoltaic cells; Shape; Short circuit currents; Voltage;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Photovoltaic Specialists Conference, 2008. PVSC '08. 33rd IEEE
  • Conference_Location
    San Diego, CA, USA
  • ISSN
    0160-8371
  • Print_ISBN
    978-1-4244-1640-0
  • Electronic_ISBN
    0160-8371
  • Type

    conf

  • DOI
    10.1109/PVSC.2008.4922757
  • Filename
    4922757