DocumentCode
3382401
Title
Intra-IC Inspection and Metrology with Picosecond Laser Ultrasonics
Author
Andriamonje, G. ; Pouget, V. ; Ousten, Y. ; Lewis, D. ; Fouillat, P. ; Danto, Y.
Author_Institution
UMR CNRS, Univ. Bordeaux, Talence
Volume
3
fYear
2005
fDate
16-19 May 2005
Firstpage
2242
Lastpage
2246
Abstract
This paper presents the application of picosecond laser ultrasonics for integrated circuit inspection and failure analysis. The technique is described and illustrated with several results. The potential for metal and inter-metal layers metrology in the context of process characterization is illustrated
Keywords
failure analysis; inspection; integrated circuit measurement; integrated circuit testing; measurement by laser beam; ultrasonic measurement; failure analysis; integrated circuit inspection; inter-metal layers metrology; intra-IC inspection; metal layers metrology; picosecond laser ultrasonics; process characterization; Acoustic pulses; Acoustic waves; Failure analysis; Inspection; Laser excitation; Metrology; Optical pulses; Optical pumping; Pulse measurements; Pump lasers; integrated circuits failure analysis; picosecond ultrasonics; pump-probe laser interferometry; thin film metrology;
fLanguage
English
Publisher
ieee
Conference_Titel
Instrumentation and Measurement Technology Conference, 2005. IMTC 2005. Proceedings of the IEEE
Conference_Location
Ottawa, Ont.
Print_ISBN
0-7803-8879-8
Type
conf
DOI
10.1109/IMTC.2005.1604575
Filename
1604575
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