• DocumentCode
    3383422
  • Title

    A concurrent dual-band 2.4/5.2 GHz low-noise amplifier using gain enhanced techniques

  • Author

    Yu-Jun Hong ; San-Fu Wang ; Po-Tsung Chen ; Yuh-Shyan Hwang ; Jiann-Jong Chen

  • Author_Institution
    Dept. of Electron. Eng., Nat. Taipei Univ. of Technol., Taipei, Taiwan
  • fYear
    2015
  • fDate
    26-29 May 2015
  • Firstpage
    231
  • Lastpage
    234
  • Abstract
    This paper presents the design and experimental results of a concurrent dual-band 2.4/5.2GHz low-noise amplifier. To achieve the concurrent gain and impedance matching at the both bands, input and output matching using two poles matching and LC resonant network are implementation, respectively. In low-noise amplifier using gain enhanced technique in order to improve gain since LC resonant matching network limit gain. The LNA is has been fabricated in a 0.18-um CMOS process and employs a supply voltage of 1 V. The measured power gain and noise figure for 2.4GHz (5.2GHz) is 12.9dB (8.9dB) and 3.7dB (3.7dB), respectively. The linearity parameters of IP1dB and IIP3 are -14dBm and -4dBm at 2.4GHz, and -11dBm and -1dBm at 5.2GHz, respectively. The power consumption is 7.6mW.
  • Keywords
    CMOS integrated circuits; LC circuits; UHF amplifiers; circuit resonance; impedance matching; low noise amplifiers; microwave amplifiers; CMOS process; IIP3; IP1dB; LC resonant matching network; complementary metal oxide semiconductor; concurrent dual-band LNA; concurrent gain; frequency 2.4 GHz; frequency 5.2 GHz; gain 12.9 dB; gain 8.9 dB; gain enhanced technique; impedance matching; low-noise amplifier; noise figure; power 7.6 mW; power consumption; power gain; size 0.18 mum; voltage 1 V; CMOS integrated circuits; Dual band; Impedance matching; Low-noise amplifiers; Noise measurement; Resonant frequency; Wireless communication; Concurrent; dual-band; gain-enhanced; low-noise amplifier (LNA);
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electromagnetic Compatibility (APEMC), 2015 Asia-Pacific Symposium on
  • Conference_Location
    Taipei
  • Print_ISBN
    978-1-4799-6668-4
  • Type

    conf

  • DOI
    10.1109/APEMC.2015.7175329
  • Filename
    7175329