• DocumentCode
    3384299
  • Title

    Valuation of yield management investments

  • Author

    Wang, Eric ; Holtan, Marius ; Akella, Ram ; Emami, Iraj ; McIntyre, Mike ; Jensen, Dave ; Fletcher, Dave

  • Author_Institution
    Dept. of Eng.-Econ. Syst. & Oper. Res., Stanford Univ., CA, USA
  • fYear
    1997
  • fDate
    10-12 Sep 1997
  • Firstpage
    1
  • Lastpage
    7
  • Abstract
    The objective of this paper is to develop a novel and effective model for the valuation of yield management system investments. We first present a innovative cost-of-ownership model, in actuality, a benefit of ownership model, to perform the cost benefit analysis of a defect metrology investment project. Compared to the traditional COO methodology, our model correctly incorporates the benefits achieved through yield management systems. We also demonstrate how the discounted cash flow analysis captures the time value of the investment, which is ignored by all COO models. Specific examples on excursion reduction and baseline improvement are provided. Finally, we present a case where the operational model of the tool is applied directly to evaluate the benefit of different yield management strategies
  • Keywords
    circuit optimisation; cost-benefit analysis; human resource management; integrated circuit yield; investment; baseline improvement; benefit of ownership model; cost benefit analysis; cost-of-ownership model; defect metrology investment project; discounted cash flow analysis; excursion reduction; investments; operational model; time value; yield management investments; yield management strategies; Cost accounting; Engineering management; Fabrication; Inspection; Investments; Metrology; Operations research; Production systems; Semiconductor device manufacture; Systems engineering and theory;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Advanced Semiconductor Manufacturing Conference and Workshop, 1997. IEEE/SEMI
  • Conference_Location
    Cambridge, MA
  • ISSN
    1078-8743
  • Print_ISBN
    0-7803-4050-7
  • Type

    conf

  • DOI
    10.1109/ASMC.1997.630693
  • Filename
    630693