Power noise suppression technique using active decoupling capacitor for TSV 3D integration

In three-dimensional (3D) integration, the increasing supply current through both package and through-silicon-via (TSV) would lead to a large simultaneous switching noise potentially. In this paper, a noise suppression technique using low power active decoupling capacitors (DECAPs) is proposed for TSV 3D integration. Through the latch-based noise detection circuitry, the power supply noise can be detected and regulated via active DECAPs. Based on UMC 65 nm CMOS technology and TSV model at 1 V supply voltage, the proposed noise suppression circuit can realize maximum 7.4 dB supply noise reduction and 12 X boost fact at the resonant frequency.