• DocumentCode
    3384830
  • Title

    Throughput estimation for ModelSim simulator tool based HW/SW co-verification system

  • Author

    Ruan, A.W. ; Liao, Y.B. ; Li, P. ; Li, W.C. ; Li, W.

  • Author_Institution
    State Key Lab. of Electron. Films & Integrated Devices, Univ. of Electron. Sci. & Technol. of China, Chengdu, China
  • fYear
    2009
  • fDate
    23-25 July 2009
  • Firstpage
    1014
  • Lastpage
    1018
  • Abstract
    Efficient and reliable verification system is requested for a system-on-chip (SOC) design before it is committed to production. The intention of the paper is to judge whether our hardware/software (HW/SW) co-verification system can handle SOC verification and provide the necessary performance in terms of co-verification speed and throughput. A finite impulse response (FIR) filter is utilized as a device-under-test (DUT) to compare pure software simulation, ModelSim simulator in this case, and HW/SW co-verification approaches to decide on whether the HW/SW co-verification system can work or not. Experiment result demonstrates the more complicated SOC is, the greater the potential speedup of the co-verification approach over software simulation is. However, the communication between software and hardware in HW/SW co-verification system is a major bottleneck, which may offset the acceleration achieved by moving large computation from software side to hardware side.
  • Keywords
    FIR filters; hardware-software codesign; integrated circuit design; system-on-chip; ModelSim simulator tool; device-under-test; finite impulse response filter; hardware/software coverification system; system-on-chip design; throughput estimation; Communication system software; Electronic design automation and methodology; Field programmable gate arrays; Finite impulse response filter; Hardware; Software performance; Software testing; Software tools; System-on-a-chip; Throughput;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Communications, Circuits and Systems, 2009. ICCCAS 2009. International Conference on
  • Conference_Location
    Milpitas, CA
  • Print_ISBN
    978-1-4244-4886-9
  • Electronic_ISBN
    978-1-4244-4888-3
  • Type

    conf

  • DOI
    10.1109/ICCCAS.2009.5250328
  • Filename
    5250328